 When you click the Amazon logo to the left of any citation and purchase the book (or other media) from Amazon.com, MIT OpenCourseWare will receive up to 10% of this purchase and any other purchases you make during that visit. This will not increase the cost of your purchase. Links provided are to the US Amazon site, but you can also support OCW through Amazon sites in other regions. Learn more. |
Special software is required to use some of the files in this section: .jmp and .xls.
Course readings.
| SES # |
TOPICS |
READINGS |
| 1 |
Introduction — processes and variation framework |
Process control overview (PDF)
Boning, Duane S., et al. "A General Semiconductor Process Modeling Framework." IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.
|
| 5 |
Probability models, parameter estimation, and sampling |
Kurtosis handout (PDF)
|
| 10 |
Yield modeling |
Ciplickas, Dennis J., et al. "Predictive Yield Modeling of VLSIC's." IEEE 5th International Workshop on Statistical Metrology (June 2000): 28-37.
Stapper, Charles H., and Raymond J. Rosner. "Integrated Circuit Yield Management and Yield Analysis: Development and Implementation." IEEE Transactions on Semiconductor Manufacturing 8 (May 1995): 95-102.
|
| 17 |
Nested variance components |
Drain, Davis. "Variance Components and Process Sampling Design." Chapter 3 in Statistical Methods for Industrial Process Control. New York, NY: Chapman & Hall, 1996. ISBN: 9780412085116.
Example, nested variance components (XLS)
|
| 19 |
Case study 1: tungsten CVD DOE/RSM |
Example, tungsten RSM (XLS)
Example, tungsten RSM (JMP)
|
| 20 |
Case study 2: cycle to cycle control |
Hardt, D. E., and Tsz-Sin Siu. "Cycle to Cycle Manufacturing Process Control." SMA, 2002.
Rzepniewski, Adam K., et al. "Cycle-to-Cycle Control of Multivariable Manufacturing Processes with Process Model Uncertainty." ASME International Mechanical Engineering Congress and Exposition (2004): IMECE2004-61783.
|
| 21 |
Case study 3: spatial modeling |
Guo, Ruey-Shan, and Emanuel Sachs. "Modeling, Optimization, and Control of Spatial Uniformity in Manufacturing Processes." IEEE Transactions on Semiconductor Manufacturing 6 (February 1993): 41-57.
Davis, Joseph C., et al. "A Robust Metric for Measuring Within-Wafer Uniformity." IEEE Transactions on Components, Packaging, and Manufacturing Technology C 19 (October 1996): 283-289.
Mozumder, Purnendu K., and Lee M. Loewenstein. "Method for Semiconductor Process Optimization Using Functional Representations of Spatial Variations and Selectivity." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15 (June 1992): 311-316.
|