<?xml version="1.0" encoding="utf-8"?><?xml-stylesheet title="XSL_formatting" type="text/xsl" href="../../style/rss10.xsl"?><rdf:RDF xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns="http://purl.org/rss/1.0/" xmlns:dc="http://purl.org/dc/elements/1.1/"><channel rdf:about="http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/index.htm"><title>MIT OpenCourseWare: New Courses in Materials Science and Engineering</title><description>New courses in Materials Science and Engineering</description><link>http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/index.htm</link><dc:date>2009-07-02</dc:date><dc:publisher>MIT OpenCourseWare http://ocw.mit.edu</dc:publisher><dc:language>en-US</dc:language><dc:rights>Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htm</dc:rights><items><rdf:Seq><rdf:li rdf:resource="http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-23Fall-2007/CourseHome/index.htm" /><rdf:li rdf:resource="http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-22Spring-2008/CourseHome/index.htm" /><rdf:li rdf:resource="http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-042Spring-2008/CourseHome/index.htm" /></rdf:Seq></items></channel><item rdf:about="http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-23Fall-2007/CourseHome/index.htm"><title>3.23 Electrical, Optical, and Magnetic Properties of Materials (MIT)</title><description>Origin of electrical, magnetic and optical properties of materials. Focus on the acquisition of quantum mechanical tools. Analysis of the properties of materials. Presentation of the postulates of quantum mechanics. Examination of the hydrogen atom, simple molecules and bonds, and the behavior of electrons in solids and energy bands. Introduction of the variation principle as a method for the calculation of wavefunctions. Investigation of how and why materials respond to different electrical, magnetic and electromagnetic fields and probes. Study of the conductivity, dielectric function, and magnetic permeability in metals, semiconductors, and insulators. Survey of common devices such as transistors, magnetic storage media, optical fibers.</description><link>http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-23Fall-2007/CourseHome/index.htm</link><dc:creator>Marzari, Nicola</dc:creator><dc:creator>Paul, David</dc:creator><dc:date>2009-06-26T05:42:11-04:00</dc:date><dc:relation>3.23</dc:relation><dc:language>en-US</dc:language><dc:subject>Materials Science and Engineering</dc:subject><dc:subject>Nuclear Physics</dc:subject><dc:subject>Photobiology</dc:subject><dc:subject>phonons</dc:subject><dc:subject>nanoparticles</dc:subject><dc:subject>luminescence</dc:subject><dc:subject>p-n junction</dc:subject><dc:subject>semiconductor engineering</dc:subject><dc:subject>spintronics</dc:subject><dc:subject>particle wells</dc:subject><dc:subject>magnetic domains</dc:subject><dc:subject>functional materials</dc:subject><dc:subject>quantum mechanics</dc:subject><dc:publisher>MIT OpenCourseWare http://ocw.mit.edu</dc:publisher><dc:rights>Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htm</dc:rights></item><item rdf:about="http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-22Spring-2008/CourseHome/index.htm"><title>3.22 Mechanical Behavior of Materials (MIT)</title><description>Phenomenology of mechanical behavior of materials at the macroscopic level. Relationship of mechanical behavior to material structure and mechanisms of deformation and failure. Topics include: elasticity, viscoelasticity, plasticity, creep, fracture, and fatigue. Case studies and examples drawn from a variety of classes of materials including: metals, ceramics, polymers, thin films, composites, and cellular materials.</description><link>http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-22Spring-2008/CourseHome/index.htm</link><dc:creator>van Vliet, Krystyn</dc:creator><dc:date>2009-05-19T04:02:44-04:00</dc:date><dc:relation>3.22</dc:relation><dc:language>en-US</dc:language><dc:subject>Materials Science and Engineering</dc:subject><dc:subject>Polymer/Plastics Engineering</dc:subject><dc:subject>viral capsides</dc:subject><dc:subject>student projects</dc:subject><dc:subject>defect nucleation</dc:subject><dc:subject>superelastic alloys</dc:subject><dc:subject>battery materials</dc:subject><dc:subject>carbon nanotubes</dc:subject><dc:subject>thin films</dc:subject><dc:subject>semiconductor diodes</dc:subject><dc:subject>composition</dc:subject><dc:subject>microstructure</dc:subject><dc:subject>polymers</dc:subject><dc:subject>ceramics</dc:subject><dc:subject>semiconductors</dc:subject><dc:subject>metals</dc:subject><dc:subject>fatigue</dc:subject><dc:subject>fracture</dc:subject><dc:subject>creep</dc:subject><dc:subject>plasticity</dc:subject><dc:subject>viscoelasticity</dc:subject><dc:subject>elasticity</dc:subject><dc:subject>failure</dc:subject><dc:subject>deformation</dc:subject><dc:subject>material structure</dc:subject><dc:subject>mechanical behavior</dc:subject><dc:subject>Phenomenology</dc:subject><dc:publisher>MIT OpenCourseWare http://ocw.mit.edu</dc:publisher><dc:rights>Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htm</dc:rights></item><item rdf:about="http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-042Spring-2008/CourseHome/index.htm"><title>3.042 Materials Project Laboratory (MIT)</title><description> As its name implies, the 3.042 Materials Project Laboratory involves working with such operations as investment casting of metals, injection molding of polymers, and sintering of ceramics. After all the abstraction and theory in the lecture part of the DMSE curriculum, many students have found this hands-on experience with materials to be very fun stuff - several have said that 3.042/3.082 was their favorite DMSE subject. The lab is more than operating processing equipment, however. It is intended also to emulate professional practice in materials engineering project management, with aspects of design, analysis, teamwork, literature and patent searching, web creation and oral presentation, and more.</description><link>http://ocw.mit.edu/OcwWeb/Materials-Science-and-Engineering/3-042Spring-2008/CourseHome/index.htm</link><dc:creator>Chiang, Yet-Ming</dc:creator><dc:creator>Roylance, David</dc:creator><dc:date>2009-01-26T03:37:08-05:00</dc:date><dc:relation>3.042</dc:relation><dc:language>en-US</dc:language><dc:subject>Materials Science and Engineering</dc:subject><dc:subject>Taxidermy/Taxidermist</dc:subject><dc:subject>and hands-on work using student and MIT laboratory shops. Teams document their progress and final results by means of web pages and weekly oral presentations. Instruction and practice in oral communication provided.</dc:subject><dc:subject>communications and computer skills</dc:subject><dc:subject>project management</dc:subject><dc:subject>and fabrication of a deliverable prototype. Emphasis on teamwork</dc:subject><dc:subject>processing and performance</dc:subject><dc:subject>understanding trade-offs between design</dc:subject><dc:subject>etc.) appropriate for the materials and device of interest. Goals include using MSE fundamentals in a practical application</dc:subject><dc:subject>physical vapor deposition</dc:subject><dc:subject>three-dimensional printing</dc:subject><dc:subject>powder processing</dc:subject><dc:subject>investment casting</dc:subject><dc:subject>thermoforming</dc:subject><dc:subject>Student project teams design and fabricate a materials engineering prototype using processing technologies (injection molding</dc:subject><dc:publisher>MIT OpenCourseWare http://ocw.mit.edu</dc:publisher><dc:rights>Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/OcwWeb/web/terms/terms/index.htm</dc:rights></item></rdf:RDF>