* nominal device models for 6.004 .global vdd .temp 25 VDD vdd 0 3.3v .MODEL NENH NMOS LEVEL=3 PHI=0.700000 TOX=9.4000E-09 XJ=0.200000U TPG=1 + VTO=0.6746 DELTA=1.1480E+00 LD=3.4510E-08 KP=1.8217E-04 + UO=495.9 THETA=1.7960E-01 RSH=3.2470E+01 GAMMA=0.5383 + NSUB=1.1780E+17 NFS=7.1500E+11 VMAX=2.5000E+05 ETA=2.1880E-02 + KAPPA=4.2390E-01 CGDO=9.0000E-11 CGSO=9.0000E-11 + CGBO=3.7441E-10 CJ=5.79E-04 MJ=0.611 CJSW=2.00E-11 + MJSW=0.621 PB=0.99 .MODEL PENH PMOS LEVEL=3 PHI=0.700000 TOX=9.4000E-09 XJ=0.200000U TPG=-1 + VTO=-0.8887 DELTA=1.0060E+00 LD=1.0920E-08 KP=4.5773E-05 + UO=124.6 THETA=6.9020E-02 RSH=1.9550E-01 GAMMA=0.4097 + NSUB=6.8230E+16 NFS=6.5000E+11 VMAX=1.0000E+06 ETA=4.2420E-02 + KAPPA=8.6130E+00 CGDO=9.0000E-11 CGSO=9.0000E-11 + CGBO=3.5362E-10 CJ=9.30E-04 MJ=0.485 CJSW=2.32E-10 + MJSW=0.213 PB=0.89 .options SCALE=0.6u CADJUST=0.87 .options vih=2.7 vil=0.6 .plotdef betaop + ??? ??? ??? ??? ??? ??? ??? ??? + ??? ??? ??? ??? ??? ??? ??? ??? + ??? ??? ??? ??? ??? ??? ??? ??? + LD ST ??? JMP ??? BEQ BNE LDR + ADD SUB MUL DIV CMPEQ CMPLT CMPLE ??? + AND OR XOR ??? SHL SHR SRA ??? + ADDC SUBC MULC DIVC CMPEQC CMPLTC CMPLEC ??? + ANDC ORC XORC ??? SHLC SHRC SRAC ??? *PROCESS PARAMETERS N+DIFF P+DIFF POLY METAL1 METAL2 METAL3 UNITS * Sheet Resistance 2.1 2.0 1.9 0.07 0.07 0.03 ohms/sq * Width Variation -0.36 -0.29 -0.04 0.16 -0.04 -0.30 microns * (measured - drawn) * Contact Resistance 2.3 2.2 2.2 0.82 0.87 ohms * Gate Oxide Thickness 94 angstroms *CAPACITANCE PARAMETERS N+DIFF P+DIFF POLY METAL1 METAL2 METAL3 UNITS * Area (substrate) 546 929 92 47 25 25 aF/um^2 * Area (poly) 59 18 11 aF/um^2 * Area (metal1) 37 14 aF/um^2 * Area (metal2) 33 aF/um^2 * Area (N+active) 3684 aF/um^2 * Area (P+active) 3500 aF/um^2 * Fringe (substrate) 195 234 aF/um * Fringe (N+active) 105 aF/um