HST.410J | Spring 2007 | Undergraduate

Projects in Microscale Engineering for the Life Sciences

Labs

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Description:

After spinning, the wafer is transferred to a hot plate for a process called a “soft bake”. This process gets rid of the solvent that is mixed in with the SU-8 to keep it from hardening in the bottle. It also helps the SU-8 adhere to the wafer.

Resource Type:
Labs
Alt text:
Wafer is carefully transferred to a hot plate.
Caption:
After spinning, the wafer is transferred to a hot plate for a process called a “soft bake”. This process gets rid of the solvent that is mixed in with the SU-8 to keep it from hardening in the bottle. It also helps the SU-8 adhere to the wafer.
Credit:
Photo by Dr. Aranyosi.
Wafer is carefully transferred to a hot plate.
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