Design and Manufacturing II

Bulk micromachined silicon bonded on top of pyrex with a back side hole.

A diagram showing bulk micromachined silicon bonded on top of pyrex with a back side hole. The membrane deflection is measured by four piezoresistors forming a Wheatstone bridge to get the pressure from the back side hole. (Image courtesy of OCW.)

Instructor(s)

MIT Course Number

2.008

As Taught In

Spring 2004

Level

Undergraduate

Translated Versions

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Course Features

Course Description

This course introduces you to modern manufacturing with four areas of emphasis: manufacturing processes, equipment/control, systems, and design for manufacturing. The course exposes you to integration of engineering and management disciplines for determining manufacturing rate, cost, quality and flexibility. Topics include process physics, equipment design and automation/control, quality, design for manufacturing, industrial management, and systems design and operation. Labs are integral parts of the course, and expose you to various manufacturing disciplines and practices.

Other OCW Versions

OCW has published multiple versions of this subject. Question_OVT logo

Chun, Jung-Hoon, and Sang-Gook Kim. 2.008 Design and Manufacturing II, Spring 2004. (MIT OpenCourseWare: Massachusetts Institute of Technology), http://ocw.mit.edu/courses/mechanical-engineering/2-008-design-and-manufacturing-ii-spring-2004 (Accessed). License: Creative Commons BY-NC-SA


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