Control of Manufacturing Processes (SMA 6303)

A Si stamp patterned with grids of varying orientations and linewidths is used to stamp PMMA.

To create embossed microstructures in PMMA, the silicon stamp must be carefully patterned and manufactured. (Image courtesy of Hayden Taylor. Used with permission.)

Instructor(s)

MIT Course Number

2.830J / 6.780J / ESD.63J

As Taught In

Spring 2008

Level

Graduate

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Course Features

Course Description

This course explores statistical modeling and control in manufacturing processes. Topics include the use of experimental design and response surface modeling to understand manufacturing process physics, as well as defect and parametric yield modeling and optimization. Various forms of process control, including statistical process control, run by run and adaptive control, and real-time feedback control, are covered. Application contexts include semiconductor manufacturing, conventional metal and polymer processing, and emerging micro-nano manufacturing processes.

Hardt, David, and Duane Boning. 2.830J Control of Manufacturing Processes (SMA 6303), Spring 2008. (MIT OpenCourseWare: Massachusetts Institute of Technology), http://ocw.mit.edu/courses/mechanical-engineering/2-830j-control-of-manufacturing-processes-sma-6303-spring-2008 (Accessed). License: Creative Commons BY-NC-SA


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