2.008 | Spring 2004 | Undergraduate

Design and Manufacturing II

2-008s04.jpg

Description:

A diagram showing bulk micromachined silicon bonded on top of pyrex with a back side hole. The membrane deflection is measured by four piezoresistors forming a Wheatstone bridge to get the pressure from the back side hole. (Image courtesy of OCW.)

Alt text:
Bulk micromachined silicon bonded on top of pyrex with a back side hole.
Caption:
A diagram showing bulk micromachined silicon bonded on top of pyrex with a back side hole. The membrane deflection is measured by four piezoresistors forming a Wheatstone bridge to get the pressure from the back side hole. (Image courtesy of OCW.)
Bulk micromachined silicon bonded on top of pyrex with a back side hole.

Course Info

As Taught In
Spring 2004
Learning Resource Types
Problem Sets
Exams with Solutions
Lecture Notes