Labs
10.jpg
Description:
After spinning, the wafer is transferred to a hot plate for a process called a “soft bake”. This process gets rid of the solvent that is mixed in with the SU-8 to keep it from hardening in the bottle. It also helps the SU-8 adhere to the wafer.
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10.jpg
Alt text:
Wafer is carefully transferred to a hot plate.
Caption:
After spinning, the wafer is transferred to a hot plate for a process called a “soft bake”. This process gets rid of the solvent that is mixed in with the SU-8 to keep it from hardening in the bottle. It also helps the SU-8 adhere to the wafer.
Credit:
Photo by Dr. Aranyosi.
![Wafer is carefully transferred to a hot plate.](/courses/hst-410j-projects-in-microscale-engineering-for-the-life-sciences-spring-2007/c20bfc03fdd3e9c378e08e7f35b9e87e_10.jpg)
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2007
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