Control of Manufacturing Processes (SMA 6303)

Readings

SES #	TOPICS	READINGS
1	Introduction — processes and variation framework	Process control overview (PDF) Boning, Duane S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.
5	Probability models, parameter estimation, and sampling	Kurtosis handout (PDF)
10	Yield modeling	Ciplickas, Dennis J., et al. “Predictive Yield Modeling of VLSIC’s.” IEEE 5th International Workshop on Statistical Metrology (June 2000): 28-37. Stapper, Charles H., and Raymond J. Rosner. “Integrated Circuit Yield Management and Yield Analysis: Development and Implementation.” IEEE Transactions on Semiconductor Manufacturing 8 (May 1995): 95-102.
17	Nested variance components	Drain, Davis. “Variance Components and Process Sampling Design.” Chapter 3 in Statistical Methods for Industrial Process Control. New York, NY: Chapman & Hall, 1996. ISBN: 9780412085116. Example, nested variance components (XLS)
19	Case study 1: tungsten CVD DOE/RSM	Example, tungsten RSM (XLS) Example, tungsten RSM (JMP)
20	Case study 2: cycle to cycle control	Hardt, D. E., and Tsz-Sin Siu. “Cycle to Cycle Manufacturing Process Control.” SMA, 2002. Rzepniewski, Adam K., et al. “Cycle-to-Cycle Control of Multivariable Manufacturing Processes with Process Model Uncertainty.” ASME International Mechanical Engineering Congress and Exposition (2004): IMECE2004-61783.
21	Case study 3: spatial modeling	Guo, Ruey-Shan, and Emanuel Sachs. “Modeling, Optimization, and Control of Spatial Uniformity in Manufacturing Processes.” IEEE Transactions on Semiconductor Manufacturing 6 (February 1993): 41-57. Davis, Joseph C., et al. “A Robust Metric for Measuring Within-Wafer Uniformity.” IEEE Transactions on Components, Packaging, and Manufacturing Technology C 19 (October 1996): 283-289. Mozumder, Purnendu K., and Lee M. Loewenstein. “Method for Semiconductor Process Optimization Using Functional Representations of Spatial Variations and Selectivity.” IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15 (June 1992): 311-316.