SES # | TOPICS | READINGS |
---|---|---|

1 | Introduction — processes and variation framework |
Process control overview (PDF) Boning, Duane S., et al. “A General Semiconductor Process Modeling Framework.” |

5 | Probability models, parameter estimation, and sampling |
Kurtosis handout (PDF) |

10 | Yield modeling |
Ciplickas, Dennis J., et al. “Predictive Yield Modeling of VLSIC’s.” Stapper, Charles H., and Raymond J. Rosner. “Integrated Circuit Yield Management and Yield Analysis: Development and Implementation.” |

17 | Nested variance components |
Drain, Davis. “Variance Components and Process Sampling Design.” Chapter 3 in Example, nested variance components (XLS) |

19 | Case study 1: tungsten CVD DOE/RSM |
Example, tungsten RSM (XLS) Example, tungsten RSM (JMP) |

20 | Case study 2: cycle to cycle control |
Hardt, D. E., and Tsz-Sin Siu. “Cycle to Cycle Manufacturing Process Control.” Rzepniewski, Adam K., et al. “Cycle-to-Cycle Control of Multivariable Manufacturing Processes with Process Model Uncertainty.” |

21 | Case study 3: spatial modeling |
Guo, Ruey-Shan, and Emanuel Sachs. “Modeling, Optimization, and Control of Spatial Uniformity in Manufacturing Processes.” Davis, Joseph C., et al. “A Robust Metric for Measuring Within-Wafer Uniformity.” Mozumder, Purnendu K., and Lee M. Loewenstein. “Method for Semiconductor Process Optimization Using Functional Representations of Spatial Variations and Selectivity.” |

## Readings

Course Info

Instructors

Departments

As Taught In

Spring
2008

Level

Topics

Learning Resource Types

*theaters*Demonstration Videos

*assignment_turned_in*Problem Sets with Solutions

*grading*Exams with Solutions

*notes*Lecture Notes

*theaters*Lecture Videos

*assignment_turned_in*Written Assignments with Examples