Assignments
ps3.pdf
Description:
Problem set on bending of an AFM cantilever, thermal stress induced wafer curvature, circuit loading, leveraged bending with electrostatic actuation, and circuit representation of a lumped mechanical system.
Resource Type:
Problem Sets
pdf
98 kB
ps3.pdf
Course Info
Instructors
As Taught In
Spring
2007
Level
Course Info
Instructors
As Taught In
Spring
2007
Level
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