The number of lectures on each topic are given in parentheses. For the detailed schedule of topics, see the calendar below.
I. Introduction (0.5)
An overview of microelectromechanical devices and technologies, and an introduction to design and modeling.
II. Fabrication Technology (4)
Brief review of standard microelectronic fabrication technologies; detailed discussion of bulk micromachining, surface micromachining, bonding technologies, related fabrication methods, and creating process flows. Assignments will emphasize creating process flows, the relation between process and mask specifications and the resulting device geometry, and also the effect of etch selectivity on process viability.
III. Material Properties (0.5)
Definitions of mechanical, thermal, electrical, magnetic, optical, and chemical properties of materials.
IV. Lumped Modeling (3)
Introduction to lumped modeling of systems and transducers; an overview of system dynamics.
V. Split Sessions: Introductory Mechanics or Introductory Electronics (2)
Classes will be held in parallel on both introductory mechanics (2.001 - 2.002 level) and introductory electronics (6.002 level). Students with equivalent undergraduate mechanics preparation should attend the electronics sessions, and students with equivalent undergraduate electronics preparation should attend the mechanics sessions. Students who do not have equivalent undergraduate preparation in either area should attend the electronics sessions. A mechanics make up session will be scheduled for those students.
VI. Mechanics: Special Topics (1)
MEMS examples, energy methods.
VII. Dissipation (2)
The thermal energy domain; modeling dissipative processes.
VIII. Fluids and Transport (3)
A necessarily brief introduction to the fluid mechanics and transport processes relevant at the microscale.
IX. System Issues (2)
Feedback and noise.
X. Case Studies and Special Topics (6)
While students are working on final projects, there will be a series of eight lectures covering packaging, design tradeoffs, as well as case studies taken from various MEMS disciplines (e.g., optical MEMS, accelerometers, BioMEMS, Power MEMS).
JV: Session taught by Joel Voldman
CL: Session taught by Carol Livermore
|LEC #||TOPICS||LECTURERS||KEY DATES|
|1||Introduction to MEMS; microfabrication for MEMS: part I||JV/CL|
|2||Microfabrication for MEMS: part II||CL||Problem set 1 out|
|3||Microfabrication for MEMS: part III||CL|
|4||Microfabrication for MEMS: part IV; in-class fab problem||CL||
Problem set 1 due
Problem set 2 out
|5||Fabrication for the life sciences; material properties||CL|
|6||Elasticity or electronics I||CL/JV||
Problem set 2 due
Problem set 3 out
|7||Structures or electronics II||CL/JV|
Problem set 3 due
Problem set 4 out
|10||Dynamics, especially nonlinear||JV|
|11||Structures special topics||CL||Design problem out|
|12||Thermal energy domain; dissipation||JV||Problem set 4 due|
|13||Modeling dissipative processes||JV||
Design problem due
Problem set 5 out 2 days before L13
Problem set 5 due
Problem set 6 out
Problem set 6 due
Problem set 7 out
|19||Packaging||CL||Problem set 7 due|
|20||In-class design problem||CL|
|22||Power MEMS case study||CL|
|23||Optical MEMS case study||CL|
|24||Capacitive accelerometer case study||JV|
|25||BioMEMS case study||JV|
|Final presentations||Final report due 6 days after L25|