|1||Introduction — processes and variation framework|| |
Process control overview (PDF)
Boning, Duane S., et al. "A General Semiconductor Process Modeling Framework." IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.
|5||Probability models, parameter estimation, and sampling|| |
Kurtosis handout (PDF)
|10||Yield modeling|| |
Ciplickas, Dennis J., et al. "Predictive Yield Modeling of VLSIC's." IEEE 5th International Workshop on Statistical Metrology (June 2000): 28-37.
Stapper, Charles H., and Raymond J. Rosner. "Integrated Circuit Yield Management and Yield Analysis: Development and Implementation." IEEE Transactions on Semiconductor Manufacturing 8 (May 1995): 95-102.
|17||Nested variance components|| |
Example, nested variance components (XLS)
|19||Case study 1: tungsten CVD DOE/RSM|| |
Example, tungsten RSM (XLS)
Example, tungsten RSM (JMP)
|20||Case study 2: cycle to cycle control|| |
Hardt, D. E., and Tsz-Sin Siu. "Cycle to Cycle Manufacturing Process Control." SMA, 2002.
Rzepniewski, Adam K., et al. "Cycle-to-Cycle Control of Multivariable Manufacturing Processes with Process Model Uncertainty." ASME International Mechanical Engineering Congress and Exposition (2004): IMECE2004-61783.
|21||Case study 3: spatial modeling|| |
Guo, Ruey-Shan, and Emanuel Sachs. "Modeling, Optimization, and Control of Spatial Uniformity in Manufacturing Processes." IEEE Transactions on Semiconductor Manufacturing 6 (February 1993): 41-57.
Davis, Joseph C., et al. "A Robust Metric for Measuring Within-Wafer Uniformity." IEEE Transactions on Components, Packaging, and Manufacturing Technology C 19 (October 1996): 283-289.
Mozumder, Purnendu K., and Lee M. Loewenstein. "Method for Semiconductor Process Optimization Using Functional Representations of Spatial Variations and Selectivity." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15 (June 1992): 311-316.